Remote disassembly of electronics-free modular structures
X
Xinyi Yang
(School of Materials Science and Engineering, Tianjin University, Tianjin, China.)
M
Martin Nisser
V
Victor Riera Naranjo
W
Weijian Qian
C
Christos E. Athanasiou
(Daniel Guggenheim School of Aerospace Engineering)
B
Bolei Deng
Article Details
Journal
Nature Communications
Volume / Issue
Vol. 17, Issue 1
Published
May 06, 2026
ISSN
2041-1723
Publisher
Nature Portfolio
Authors (6)
X
Xinyi Yang
School of Materials Science and Engineering, Tianjin University, Tianjin, China.
M
Martin Nisser
V
Victor Riera Naranjo
W
Weijian Qian
C
Christos E. Athanasiou
Daniel Guggenheim School of Aerospace Engineering
B
Bolei Deng
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