Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs
A
Anish Rao Lakkaraju
H
Helene Conseil-Gudla
M
Mike Bixenman
R
Rajan Ambat
Article Details
Journal
Scientific Reports
Volume / Issue
Vol. 15, Issue 1
Published
July 02, 2025
ISSN
2045-2322
Publisher
Nature Portfolio
Authors (4)
A
Anish Rao Lakkaraju
H
Helene Conseil-Gudla
M
Mike Bixenman
R
Rajan Ambat
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