Rapid Drying Principle for High‐speed, Pinhole‐Less, Uniform Wet Deposition Protocols of Water‐Dispersed 2D Materials (Adv. Mater. 15/2025)
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Authors (14)
Kyeonghun Jeong
Department of Materials Science and Engineering Hongik University Seoul 04066 Republic of Korea
Chansoo Kim
Ha Young Lee
Department of Materials Science and Engineering Hongik University Seoul 04066 Republic of Korea
Junyi Zhao
School of Nuclear Science and Technology
Soo‐Hyung Choi
Department of Chemical Engineering Hongik University Seoul 04066 Republic of Korea
Jeong‐A Bae
Department of Chemical Engineering Hongik University Seoul 04066 Republic of Korea
Hyun‐Sik Kim
Department of Materials Science & Engineering Kyung Hee University Yongin 17104 Republic of Korea
Jeong‐Yeon Kim
Department of Materials Science and Engineering University of Seoul Seoul 02504 Republic of Korea
Youjin Kim
Heechae Choi
Department of Chemistry Xi'an Jiaotong‐Liverpool University Suzhou 215123 P. R. China
Alloyssius E.G. Gorospe
Department of Materials Science and Engineering Hongik University Seoul 04066 Republic of Korea
Seung Joon Yoo
School of Materials Science and Engineering Gwangju Institute of Science and Technology Gwangju 61005 Republic of Korea
Chuan Wang
School of Chemistry and Molecular Engineering
Dongwook Lee
Department of Chemistry Yonsei University Seoul Republic of Korea