Piezoelectric thin films and their applications in MEMS: A review

J Jinpeng Liu H Hua Tan (College of Future Information Technology) X Xinyi Zhou W Weigang Ma (Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University) C Chuanmin Wang (School of Mechanical Science & Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,) N Nguyen-Minh-An Tran (Faculty of Chemical Engineering, Industrial University of Ho Chi Minh City 4 , Ho Chi Minh City 71420,) W Wenlong Lu F Feng Chen J Junya Wang (School of Mechanical Science & Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,) H Haibo Zhang

Abstract

With the increasing demand for devices in miniaturization, accuracy, and low power consumption, developing microdevices in the form of piezoelectric thin films is significant for microelectromechanical systems (MEMS) applications. Piezoelectric thin films offer advantages of miniaturization and low power consumption, holding immense potential in MEMS, especially with advancements in micro-nanomanufacturing technologies. In this review, we highlighted the compelling piezoelectric properties and summarized the latest research progress of thin films, with an emphasis on recent advances in piezoelectric MEMS. We mainly introduced the recent developments on different types of piezoelectric MEMS (piezo-MEMS), along with the descriptions of piezoelectric effects, film preparation, film properties, and device indicators. We have emphasized the comparison of MEMS with different piezoelectric materials and methods for improving devices. The recent achievements of piezoelectric thin films in MEMS applications and the future development of MEMS applications are also reviewed.

Article Details

Volume / Issue Vol. 137, Issue 2
Published January 14, 2025
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (10)

J

Jinpeng Liu

H

Hua Tan

College of Future Information Technology

X

Xinyi Zhou

W

Weigang Ma

Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University

C

Chuanmin Wang

School of Mechanical Science & Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,

N

Nguyen-Minh-An Tran

Faculty of Chemical Engineering, Industrial University of Ho Chi Minh City 4 , Ho Chi Minh City 71420,

W

Wenlong Lu

F

Feng Chen

J

Junya Wang

School of Mechanical Science & Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,

H

Haibo Zhang