Phonon Olympics: Phonon property and lattice thermal conductivity benchmarking from open-source packages

A Alan J. H. McGaughey (Department of Mechanical Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,) L Lucas Lindsay (Materials Science and Technology Division, Oak Ridge National Laboratory 2 , Oak Ridge, Tennessee 37831,) H Hua Bao T Tomu Hamakawa (Department of Mechanical Engineering, The University of Tokyo 4 , 7-3-1 Hongo, Bunkyo, Tokyo 113-8656,) R Rinkle Juneja (Materials Science and Technology Division, Oak Ridge National Laboratory 2 , Oak Ridge, Tennessee 37831,) S Shouhang Li (Institute of Micro/Nano Electromechanical System and Integrated Circuit, College of Mechanical Engineering, Donghua University 1 , Shanghai 201620,) W Wu Li (Leibniz-Institut für Katalyse) R Ryota Masuki (Department of Applied Physics, The University of Tokyo 9 , 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656,) F Fanchen Meng (Watt Family Innovation Center 10 , Clemson, South Carolina 29634,) H Han Meng T Tribhuwan Pandey (Department of Physics, University of Antwerp 12 , Groenenborgerlaan 171, Antwerp B-2020,) C Cheng Shao (Thermal Science Research Center, Shandong Institute of Advanced Technology 3 , Jinan, Shandong 250103,) J Junichiro Shiomi (Institute of Engineering Innovation, School of Engineering, The University of Tokyo) T Terumasa Tadano (Research Center for Magnetic and Spintronic Materials (CMSM), National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan) A Atsushi Togo A Ao Wang X Xinyu Zhang

Abstract

Three widely used open-source packages for determining phonon properties and lattice thermal conductivities (ALAMODE, phono3py, and ShengBTE) are benchmarked by teams of expert users and the package developers. The phonons for Ge, RbBr, monolayer MoSe2, and AlN are modeled at zero temperature, and they scatter through three-phonon and phonon-isotope processes, with thermal conductivities obtained from the linearized Peierls–Boltzmann transport equation with input from density functional theory calculations. Over a wide range of temperatures, the thermal conductivities calculated by the teams fall within at most ±15% of their mean values for each of the four materials. The phonon frequencies, obtained from the harmonic force constants, do not show large differences between the calculations, indicating that the modal heat capacities and group velocities are not responsible for the thermal conductivity variations. It is the lifetimes associated with three-phonon scattering, obtained from the cubic force constants, that drive the variations. The many decisions required to calculate the cubic force constants (e.g., supercell size, atomic displacement, neighbor cutoff, and application of symmetries) make identification of the precise origin of the thermal conductivity variations challenging. The calculated thermal conductivities do not generally show agreement with experimental measurements, which is attributed to the limitations of the density functional theory calculations. Guidance for the development of best practices is provided, which will help to standardize protocols needed for building thermal conductivity databases. The results provide a baseline for future benchmarking of other packages and more advanced calculations.

Article Details

Volume / Issue Vol. 138, Issue 13
Published October 07, 2025
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (17)

A

Alan J. H. McGaughey

Department of Mechanical Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,

L

Lucas Lindsay

Materials Science and Technology Division, Oak Ridge National Laboratory 2 , Oak Ridge, Tennessee 37831,

H

Hua Bao

T

Tomu Hamakawa

Department of Mechanical Engineering, The University of Tokyo 4 , 7-3-1 Hongo, Bunkyo, Tokyo 113-8656,

R

Rinkle Juneja

Materials Science and Technology Division, Oak Ridge National Laboratory 2 , Oak Ridge, Tennessee 37831,

S

Shouhang Li

Institute of Micro/Nano Electromechanical System and Integrated Circuit, College of Mechanical Engineering, Donghua University 1 , Shanghai 201620,

W

Wu Li

Leibniz-Institut für Katalyse

R

Ryota Masuki

Department of Applied Physics, The University of Tokyo 9 , 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656,

F

Fanchen Meng

Watt Family Innovation Center 10 , Clemson, South Carolina 29634,

H

Han Meng

T

Tribhuwan Pandey

Department of Physics, University of Antwerp 12 , Groenenborgerlaan 171, Antwerp B-2020,

C

Cheng Shao

Thermal Science Research Center, Shandong Institute of Advanced Technology 3 , Jinan, Shandong 250103,

J

Junichiro Shiomi

Institute of Engineering Innovation, School of Engineering, The University of Tokyo

T

Terumasa Tadano

Research Center for Magnetic and Spintronic Materials (CMSM), National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan

A

Atsushi Togo

A

Ao Wang

X

Xinyu Zhang