Perspectives of active Si photonics devices for data communication and optical sensing

X Xiaoxin Wang T Tianshu Li (Division of Materials Science and Engineering) J Juejun Hu J Jifeng Liu (Thayer School of Engineering, Dartmouth College 3 , Hanover, New Hampshire 03755,)

Abstract

Si photonics has made rapid progress in research and commercialization in the past two decades. While it started with electronic–photonic integration on Si to overcome the interconnect bottleneck in data communications, Si photonics has now greatly expanded into optical sensing, light detection and ranging (LiDAR), optical computing, and microwave/RF photonics applications. From an applied physics point of view, this perspective discusses novel materials and integration schemes of active Si photonics devices for a broad range of applications in data communications, spectrally extended complementary metal–oxide–semiconductor (CMOS) image sensing, as well as 3D imaging for LiDAR systems. We also present a brief outlook of future synergy between Si photonic integrated circuits and Si CMOS image sensors toward ultrahigh capacity optical I/O, ultrafast imaging systems, and ultrahigh sensitivity lab-on-chip molecular biosensing.

Article Details

Volume / Issue Vol. 138, Issue 6
Published August 14, 2025
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (4)

X

Xiaoxin Wang

T

Tianshu Li

Division of Materials Science and Engineering

J

Juejun Hu

J

Jifeng Liu

Thayer School of Engineering, Dartmouth College 3 , Hanover, New Hampshire 03755,