Numerical modeling of the coupled heat transfer and ultrasonic time of flight during monitoring of a laser powder bed fusion process

M M. Palla (Université Paris-Saclay, CEA LIST 1 Département d'Instrumentation Numérique, , 91191 Gif-sur-Yvette,) F F. Le Bourdais (Université Paris-Saclay, CEA LIST 1 Département d'Instrumentation Numérique, , 91191 Gif-sur-Yvette,) G G. Roux (Université Grenoble Alpes, CEA LITEN 2 Département des Technologies des Nouveaux Matériaux, , 38000 Grenoble,) J J. P. Garandet (Université Grenoble Alpes, CEA LITEN 2 Département des Technologies des Nouveaux Matériaux, , 38000 Grenoble,)

Abstract

This paper proposes a numerical model coupling heat transfer and ultrasonic time of flight (TOF) phenomena within the Laser Powder Bed Fusion (LPBF) process. A three-dimensional layer scale thermal model is developed to simulate the temperature field evolution during the LPBF process, considering the laser energy input, heat conduction, and convection heat transfer. A TOF model is developed based on the measured velocity of the ultrasonic wave in the materials involved, taking into account the temperature-dependent variations of the wave velocity in the plate and the part by coupling it to the thermal model output. The models are calibrated using experimental data from an aluminum part manufactured in a Farsoon FS271M LPBF machine. The experimental data consist of IR camera images of the part surface temperature, thermocouple measurements on the back plate, and TOF measurements throughout the process. The numerical simulations are compared with the experimental data to assess the model's accuracy and identify key parameters affecting the heat transfer and ultrasonic wave propagation. This work provides a framework for understanding the relationships between the temperature field, the TOF signal, and the LPBF process parameters, paving the way for improved process control and monitoring strategies.

Article Details

Volume / Issue Vol. 138, Issue 8
Published August 28, 2025
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (4)

M

M. Palla

Université Paris-Saclay, CEA LIST 1 Département d'Instrumentation Numérique, , 91191 Gif-sur-Yvette,

F

F. Le Bourdais

Université Paris-Saclay, CEA LIST 1 Département d'Instrumentation Numérique, , 91191 Gif-sur-Yvette,

G

G. Roux

Université Grenoble Alpes, CEA LITEN 2 Département des Technologies des Nouveaux Matériaux, , 38000 Grenoble,

J

J. P. Garandet

Université Grenoble Alpes, CEA LITEN 2 Département des Technologies des Nouveaux Matériaux, , 38000 Grenoble,