Numerical analysis of thermal-fluid characteristics of radiant manifold microchannel structure for single-phase liquid cooling in multi-heat source chips

Abstract

With the continuous evolution of Moore's law, the power density brought by three-dimensional integrated packaging technology has surged. Although the microchannel heat dissipation technology can effectively improve the heat dissipation efficiency, the traditional structure still has problems such as large pressure drop loss and uneven temperature field distribution. This study innovatively proposed a radiation manifold microchannel structure and constructed a three-dimensional fluid-solid coupling model. The single-objective sequential optimization strategy based on parameter scanning is adopted. First, the optimal outlet layout is determined, and then the width of the collector ring and the width of the microchannel end are optimized in turn. Finally, the global optimal solution is obtained by parameter combination. The results show that under the condition of four boundary heat sources with 3 × 3 mm2 and heat flux q of 400 W/cm2, when the system configuration is four-side opening outlet mode, the width of the collector ring is 0.75 mm, the width of the microchannel end is 0.75 mm, the width of the manifold is 2 mm, and the width of the central shunt channel is 2 mm, the comprehensive index of heat dissipation performance and flow characteristics is optimal. Compared with the initial model, the heat transfer efficiency is increased by 2.02%, and the flow performance is increased by 86.33%. The comprehensive heat dissipation performance and flow characteristics of the optimized model are significantly improved compared with the model before optimization, which provides a new idea for solving the heat dissipation problem of multi-heat source chips.