Multifunctional Liquid Metal–2D Material Composites: Structural Design, Properties, and Applications in Advanced Electronics

J Jingbin Yang (School of Astronautics, Beihang University 1 , Beijing 100191,) Z Zhenqiang Ye (College of Materials Science and Engineering Shenzhen University Shenzhen 518055 P. R. China) G Guangming Chen R Ruo‐Yu Dong (School of Astronautics Beihang University Beijing 100191 China)

Abstract

Abstract The rapid advancement of high‐integration electronics demands materials that unify thermal, electrical, and mechanical functionalities. Liquid metals (LMs) exhibit exceptional conductivity and self‐healing capabilities, but their intrinsic fluidity poses leakage risks. Incorporation with 2D materials yields LM–2D material composites with enhanced structural stability and multifunctional integration. This review systematically summarizes: 1) interfacial enhancement strategies (oxidation, heterometallic doping, polymer grafting, mechanochemistry) to improve wettability and dispersion; 2) representative structural designs, including blended, core–shell, layered, and 3D networks supported by elastomers or hydrogels; 3) key properties across different structural types, such as mechanical robustness, thermal conductivity, and electrical conductivity; 4) multifunctional applications enabled by enabled by property synergy, spanning thermal–mechanical coupling (thermal management), electrical–mechanical coupling (electromagnetic interference shielding, wearable sensors, and energy storage electrodes), and electrical–thermal–mechanical coupling (multifunctional films). Despite significant progress, critical challenges remain in scalable fabrication, long‐term reliability, and efficient recycling. To address these challenges, this review further discusses emerging directions for LM–2D material composites, including novel composite systems, responsive smart materials, multiscale manufacturing technologies, and AI‐assisted design, aiming to provide a roadmap for their development in next‐generation electronic applications.

Article Details

Volume / Issue Vol. 38, Issue 8
Published February 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (4)

J

Jingbin Yang

School of Astronautics, Beihang University 1 , Beijing 100191,

Z

Zhenqiang Ye

College of Materials Science and Engineering Shenzhen University Shenzhen 518055 P. R. China

G

Guangming Chen

R

Ruo‐Yu Dong

School of Astronautics Beihang University Beijing 100191 China