Molecular Chain Interpenetration–Enabled High Interfacial Compatibility of Ionic and Electronic Conductors for Stretchable Ionic Devices
Abstract
Abstract Ionic devices find applications such as flexible electronics and biomedicines and function by exploiting hybrid circuits of mobile ions and electrons. However, the poor interfacial compatibility of hard electronic conductors with soft ionic conductors in ionic devices leads to low deformability, sensitivity, electromechanical responses, and stability. Herein, an interpenetrating interface between silicone‐modified polyurethane/carbon nanotube electronic conductors and ionoelastomers in an ionic device using in situ polymerization is fabricated. A robust interpenetrating electronic/ionic conductor interface is realized through molecular chain entanglement and molecular forces (such as ion‐dipole interactions and H‐bonds), effectively enhancing the bonding strength and contact area between the components and resulting in an excellent flexibility, stability, and device performance. The electroadhesive prepared based on this strategy exhibits a superrobust shear strength of 317 kPa under a reduced voltage input of −4 V, and the diode and the transistor can undergo arbitrary deformation while maintaining the semiconductor device characteristics, including rectification and switching. In addition, electromechanical transducers exhibit sensitive electrical responses to various deformation signals. This solution to the interfacial compatibility problems of electronic and ionic conductors holds promise for the development of multifunctional ionic devices.
Article Details
Authors (12)
Yaoxian Zheng
Research Institution for Biomimetics and Soft Matter The Higher Educational Key Laboratory for Biomedical Engineering of Fujian Province Research Center of Biomedical Engineering of Xiamen Fujian Key Laboratory of Advanced Materials Department of Biomaterials College of Materials Institute of Flexible Electronics (IFE, Future Technologies) Shenzhen Research Institute of Xiamen University Xiamen University Xiamen 361005 China
Haichuan Ning
Research Institution for Biomimetics and Soft Matter The Higher Educational Key Laboratory for Biomedical Engineering of Fujian Province Research Center of Biomedical Engineering of Xiamen Fujian Key Laboratory of Advanced Materials Department of Biomaterials College of Materials Institute of Flexible Electronics (IFE, Future Technologies) Shenzhen Research Institute of Xiamen University Xiamen University Xiamen 361005 China
Bicheng Zhao
Research Institution for Biomimetics and Soft Matter The Higher Educational Key Laboratory for Biomedical Engineering of Fujian Province Research Center of Biomedical Engineering of Xiamen Fujian Key Laboratory of Advanced Materials Department of Biomaterials College of Materials Institute of Flexible Electronics (IFE, Future Technologies) Shenzhen Research Institute of Xiamen University Xiamen University Xiamen 361005 China
Yuxuan Jiang
National Key Laboratory of Strength and Structural Integrity, Institute of Solid Mechanics, School of Aeronautic Science and Engineering, Beihang University
Jitian Chen
Research Institution for Biomimetics and Soft Matter The Higher Educational Key Laboratory for Biomedical Engineering of Fujian Province Research Center of Biomedical Engineering of Xiamen Fujian Key Laboratory of Advanced Materials Department of Biomaterials College of Materials Institute of Flexible Electronics (IFE, Future Technologies) Shenzhen Research Institute of Xiamen University Xiamen University Xiamen 361005 China
Yuexiang Wu
Research Institution for Biomimetics and Soft Matter The Higher Educational Key Laboratory for Biomedical Engineering of Fujian Province Research Center of Biomedical Engineering of Xiamen Fujian Key Laboratory of Advanced Materials Department of Biomaterials College of Materials Institute of Flexible Electronics (IFE, Future Technologies) Shenzhen Research Institute of Xiamen University Xiamen University Xiamen 361005 China
Du Nie
Research Institution for Biomimetics and Soft Matter The Higher Educational Key Laboratory for Biomedical Engineering of Fujian Province Research Center of Biomedical Engineering of Xiamen Fujian Key Laboratory of Advanced Materials Department of Biomaterials College of Materials Institute of Flexible Electronics (IFE, Future Technologies) Shenzhen Research Institute of Xiamen University Xiamen University Xiamen 361005 China
Xinling Hu
Research Institution for Biomimetics and Soft Matter The Higher Educational Key Laboratory for Biomedical Engineering of Fujian Province Research Center of Biomedical Engineering of Xiamen Fujian Key Laboratory of Advanced Materials Department of Biomaterials College of Materials Institute of Flexible Electronics (IFE, Future Technologies) Shenzhen Research Institute of Xiamen University Xiamen University Xiamen 361005 China
Zijian Yan
Research Institution for Biomimetics and Soft Matter The Higher Educational Key Laboratory for Biomedical Engineering of Fujian Province Research Center of Biomedical Engineering of Xiamen Fujian Key Laboratory of Advanced Materials Department of Biomaterials College of Materials Institute of Flexible Electronics (IFE, Future Technologies) Shenzhen Research Institute of Xiamen University Xiamen University Xiamen 361005 China
Ruijie Xie
Chenyang Shi
Naibo Lin
Research Institution for Biomimetics and Soft Matter The Higher Educational Key Laboratory for Biomedical Engineering of Fujian Province Research Center of Biomedical Engineering of Xiamen Fujian Key Laboratory of Advanced Materials Department of Biomaterials College of Materials Institute of Flexible Electronics (IFE, Future Technologies) Shenzhen Research Institute of Xiamen University Xiamen University Xiamen 361005 China