Metal Oxide Nano‐Interface Boosting the Deep Ultraviolet Adjustable Noise‐Filtering In‐Sensor Computing

Z Zhongshi Ju (State Key Laboratory of Integrated Optoelectronics Key Laboratory of UV‐Emitting Materials and Technology of Ministry of Education Northeast Normal University Changchun P.R. China) P Peng Li J Jingsong Yuan (State Key Laboratory of Integrated Optoelectronics Key Laboratory of UV‐Emitting Materials and Technology of Ministry of Education Northeast Normal University Changchun P.R. China) B Boyuan Yu (Department of Chemistry, Guangdong Provincial Key Laboratory of Catalysis) B Bin Han Y Yusheng Chen (Department of Chemistry, Indiana University, 800 E. Kirkwood Avenue, Bloomington, Indiana 47405, United States) J Jiangang Ma H Haiyang Xu Y Yichun Liu P Paolo Samorì (CNRS, ISIS UMR 7006, University of Strasbourg, 8 Allée Gaspard Monge, Strasbourg F-67000, France)

Abstract

ABSTRACT Long‐afterglow light‐emitting devices (LALEDs), which combine the capabilities of sensing, memory, processing, and display integration, allow for the simultaneous implementation of optical and electrical in‐sensor computing. However, the inherently low conductivity of conventional deep‐ultraviolet (DUV) responsive materials hinders their use in the DUV‐responsive LALEDs (DUV‐LALEDs). Herein, we demonstrate that sol‐gel‐fractured indium‐magnesium oxide (InMgO) concurrently exhibits ideal nano‐interface for DUV photon absorption and semiconductor crystal for efficient charge transport via hopping, enabling to reach high mobility (0.6 cm 2 V −1 s −1 ), excellent memory dynamic range (70 dB), and responsivity (523.7 A/W). The InMgO‐based DUV‐LALEDs display an electrical and optical post‐synaptic output when irradiated with DUV light. Moreover, hardware‐level noise‐filtering processes to the pre‐synaptic weight are revealed in the DUV‐LALEDs, emerging as the inhibition of light emission due to the insufficient post‐synaptic charge injection from the channel layer. Consequently, an adjustable noise‐filtering in‐sensor computing is successfully achieved by modulating the channel length. By taking advantage of the DUV‐LALED multifunctional nature, fusion‐node reservoir computing networks are employed to accomplish multi‐dimensional recognition tasks, displaying a high recognition accuracy of 99%. These findings demonstrate that the joint materials and devices optimization is a powerful strategy for fabricating cost‐efficient DUV analytical chips.

Article Details

Volume / Issue Vol. 1, Issue 1
Published August 06, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (10)

Z

Zhongshi Ju

State Key Laboratory of Integrated Optoelectronics Key Laboratory of UV‐Emitting Materials and Technology of Ministry of Education Northeast Normal University Changchun P.R. China

P

Peng Li

J

Jingsong Yuan

State Key Laboratory of Integrated Optoelectronics Key Laboratory of UV‐Emitting Materials and Technology of Ministry of Education Northeast Normal University Changchun P.R. China

B

Boyuan Yu

Department of Chemistry, Guangdong Provincial Key Laboratory of Catalysis

B

Bin Han

Y

Yusheng Chen

Department of Chemistry, Indiana University, 800 E. Kirkwood Avenue, Bloomington, Indiana 47405, United States

J

Jiangang Ma

H

Haiyang Xu

Y

Yichun Liu

P

Paolo Samorì

CNRS, ISIS UMR 7006, University of Strasbourg, 8 Allée Gaspard Monge, Strasbourg F-67000, France