Mechanically Robust Ceramic Aerogels for Radiative Cooling and Thermal Insulation

M Meng He (European Synchrotron Radiation Facility) X Xiangyu Liu P Pengli Li C Chunyu Wang (Center for Biotechnology and Interdisciplinary Studies) Z Zhantao Pei (Department of Polymer Science and Engineering Shanghai Key Laboratory of Electrical Insulation and Thermal Aging State Key Laboratory of Polyolefins and Catalysis Shanghai Jiao Tong University Shanghai P. R. China) K Kunming Shi (Department of Polymer Science and Engineering Shanghai Key Laboratory of Electrical Insulation and Thermal Aging State Key Laboratory of Polyolefins and Catalysis Shanghai Jiao Tong University Shanghai P. R. China) F Fei Liu J Jie Chen X Xingyi Huang (Shanghai Key Laboratory of Electrical Insulation and Thermal Aging School of Chemistry and Chemical Engineering Shanghai Jiao Tong University Shanghai China)

Abstract

ABSTRACT Cooling and heating consume about half of global energy and result in various environmental problems. Radiative cooling and thermal insulation can reduce energy consumption, yet the existing materials that integrate both properties have limitations in working temperature range and mechanical robustness. Herein, we report a flexible and ultralow‐density HfO 2 ‐ZrO 2 ‐SiO 2 ceramic aerogel fabricated via a modified electrospinning method, which synergistically integrates radiative cooling, thermal insulation, mechanical robustness, and an ultrawide temperature range. It achieves high solar reflectance (98.0%) and high infrared emittance (98.4%) for daytime radiative cooling, along with ultralow thermal conductivity (24.7 mW m −1  K −1 at 2.58 mg cm −3 ), enabling 24‐hour thermal insulation. It also exhibits excellent mechanical properties at 7.50 mg cm −3 , including 245 kPa tensile strength, 1.47 MPa compressive strength, and 182 kPa bending strength, along with an ultrawide working temperature range from −196°C to 1300°C. Moreover, in lunar environment simulation experiments, our aerogel achieves ∼50.0°C cooling below ambient during the day and ∼37.5°C thermal retention above ambient at night, successfully maintaining electronics above −16.7°C in an ambient temperature of −183°C. This work provides a mechanically robust ceramic aerogel solution for low‐energy consumption, 24‐hour thermal management in aerospace, deep‐space exploration, and high‐precision instruments.

Article Details

Volume / Issue Vol. 38, Issue 42
Published July 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (9)

M

Meng He

European Synchrotron Radiation Facility

X

Xiangyu Liu

P

Pengli Li

C

Chunyu Wang

Center for Biotechnology and Interdisciplinary Studies

Z

Zhantao Pei

Department of Polymer Science and Engineering Shanghai Key Laboratory of Electrical Insulation and Thermal Aging State Key Laboratory of Polyolefins and Catalysis Shanghai Jiao Tong University Shanghai P. R. China

K

Kunming Shi

Department of Polymer Science and Engineering Shanghai Key Laboratory of Electrical Insulation and Thermal Aging State Key Laboratory of Polyolefins and Catalysis Shanghai Jiao Tong University Shanghai P. R. China

F

Fei Liu

J

Jie Chen

X

Xingyi Huang

Shanghai Key Laboratory of Electrical Insulation and Thermal Aging School of Chemistry and Chemical Engineering Shanghai Jiao Tong University Shanghai China