Mechanically Compliant and Impedance Matching Hydrogel Bioelectronics for Low‐Voltage Peripheral Neuromodulation

L Liangjie Shan Y Yu Xue X Xingmei Chen (Materials Research Laboratory, University of Illinois at Urbana-Champaign) Y Yafei Wang Y Yinghui Feng L Li Dong C Chang Wang P Pei Zhang (Department of Neurobiology, School of Basic Medicine, Tongji Medical College, Huazhong University of Science and Technology) F Fucheng Wang (State Key Laboratory for Development and Utilization of Forest Food Resources, Zhejiang A&F University) L Linna Guo (Instrumental Analysis & Research Center Sun Yat‐Sen University (South Campus) Guangzhou P. R. China) J Ji Liu

Abstract

Abstract In neural biointerfacing technologies, mitigating the mismatch in mechanical and impedance attributes between neural tissues and bioelectronics remains a central challenge for achieving high‐efficacy neuromodulation. Here, full‐hydrogel bioelectronics that demonstrate superior mechanical compliance and impedance matching with 3D peripheral nerves, allowing for low‐voltage vagus nerve stimulation, are reported. By precisely tuning the dimensional parameters through 3D printing, the hydrogel bioelectronics, initially in a 2D planar form in a dehydrated state, can curl spontaneously around nerves and form a seamless interface. During the hydration process, instant, and tough bioadhesion is achieved through a dry crosslinking mechanism, enabling a mechanically robust nerve‐electrode interface to resist dynamic yet vigorous deformations of the peripheral nerve systems. The as‐formed nerve‐electrode interface significantly mitigates the impedance mismatch, in favor of electrical stimulation at a threshold voltage of 10 mV, one order of magnitude lower than that of conventional metallic electrodes. The use of the hydrogel bioelectronics for successful stroke rehabilitation through low‐voltage vagus nerve stimulation in a rat model is also demonstrated.

Article Details

Volume / Issue Vol. 38, Issue 2
Published January 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (11)

L

Liangjie Shan

Y

Yu Xue

X

Xingmei Chen

Materials Research Laboratory, University of Illinois at Urbana-Champaign

Y

Yafei Wang

Y

Yinghui Feng

L

Li Dong

C

Chang Wang

P

Pei Zhang

Department of Neurobiology, School of Basic Medicine, Tongji Medical College, Huazhong University of Science and Technology

F

Fucheng Wang

State Key Laboratory for Development and Utilization of Forest Food Resources, Zhejiang A&F University

L

Linna Guo

Instrumental Analysis & Research Center Sun Yat‐Sen University (South Campus) Guangzhou P. R. China

J

Ji Liu