Investigation of Ti/Al/Ni/Au ohmic contacts for AlScN/GaN HEMTs

I Isabel Streicher (Fraunhofer Institute for Applied Solid State Physics IAF 2 , Tullastrasse 72, 79108 Freiburg,) S Simone Milazzo (Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM) 1 , Strada VIII n. 5-Zona Industriale, 95121 Catania,) P Patrik Straňák (Fraunhofer Institute for Applied Solid State Physics IAF , 79108 Freiburg,) L Lutz Kirste (Fraunhofer Institute for Applied Solid State Physics IAF , 79108 Freiburg,) T Teresa Duarte (Fraunhofer Institute for Applied Solid State Physics IAF , 79108 Freiburg,) S Salvatore Di Franco (Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM) 1 , Strada VIII n. 5-Zona Industriale, 95121 Catania,) V Valerio Votadoro (Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM) 1 , Strada VIII n. 5-Zona Industriale, 95121 Catania,) S Stefano Leone (Fraunhofer Institute for Applied Solid State Physics IAF , 79108 Freiburg,) G Giuseppe Greco (Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM) 1 , Strada VIII n. 5-Zona Industriale, 95121 Catania,) F Fabrizio Roccaforte (Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM) 1 , Strada VIII n. 5-Zona Industriale, 95121 Catania,)

Abstract

The high bandgap of AlScN makes it difficult to achieve ohmic contacts with a low specific contact resistance (ρc) to AlScN/GaN heterostructures. High ρc increases the on-resistance of the high-electron-mobility transistor fabricated from these heterostructures and reduces the achievable current densities. This work presents an ohmic recess process and Ti/Al/Ni/Au metallizations with a ρc of 8.83×10−5 Ω cm2 after annealing at 900 °C. Interestingly, time-of-flight secondary ion mass spectrometry reveals that out-diffusion of Sc from the barrier to the metal surface occurs at anneal temperatures above 700 °C. While this structural metamorphosis does not show a strong impact on ρc, it leads to an increase in the on-resistance and gate leakage currents, as well as to a decrease in the maximum drain current of HEMTs. At an anneal temperature of 600 °C, no thermal degradation was observed and ρc as low as 13.4×10−5 Ωcm2 are achieved.

Article Details

Volume / Issue Vol. 139, Issue 9
Published March 07, 2026
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (10)

I

Isabel Streicher

Fraunhofer Institute for Applied Solid State Physics IAF 2 , Tullastrasse 72, 79108 Freiburg,

S

Simone Milazzo

Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM) 1 , Strada VIII n. 5-Zona Industriale, 95121 Catania,

P

Patrik Straňák

Fraunhofer Institute for Applied Solid State Physics IAF , 79108 Freiburg,

L

Lutz Kirste

Fraunhofer Institute for Applied Solid State Physics IAF , 79108 Freiburg,

T

Teresa Duarte

Fraunhofer Institute for Applied Solid State Physics IAF , 79108 Freiburg,

S

Salvatore Di Franco

Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM) 1 , Strada VIII n. 5-Zona Industriale, 95121 Catania,

V

Valerio Votadoro

Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM) 1 , Strada VIII n. 5-Zona Industriale, 95121 Catania,

S

Stefano Leone

Fraunhofer Institute for Applied Solid State Physics IAF , 79108 Freiburg,

G

Giuseppe Greco

Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM) 1 , Strada VIII n. 5-Zona Industriale, 95121 Catania,

F

Fabrizio Roccaforte

Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM) 1 , Strada VIII n. 5-Zona Industriale, 95121 Catania,