Improving thermal shock resistance of segmented thermoelectric devices via metal foam integration
K
Kuai Yu
J
Jiayue Du
H
Haoyang Tong
Y
Yuxin Sun
X
Xiaoyue Yang
H
Hao Wu
X
Xiao Zhang
Z
Zihang Liu
(School of Life Science and Engineering)
C
Chun Li
(School of Materials Science and Engineering)
F
Fengkai Guo
J
Jiehe Sui
Article Details
Journal
Nature Communications
Volume / Issue
Vol. 1, Issue 1
Published
July 20, 2026
ISSN
2041-1723
Publisher
Nature Portfolio
Authors (11)
K
Kuai Yu
J
Jiayue Du
H
Haoyang Tong
Y
Yuxin Sun
X
Xiaoyue Yang
H
Hao Wu
X
Xiao Zhang
Z
Zihang Liu
School of Life Science and Engineering
C
Chun Li
School of Materials Science and Engineering
F
Fengkai Guo
J
Jiehe Sui
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