Impedance‐Domain Decoupled Single‐Architecture Multimodal Strain Sensor Array for Full‐Field Strain Mapping

H Hao Yin T Tao Wang W Wangze Ni (School of Integrated Circuit (School of Information Science and Electronic Engineering) Shanghai Jiao Tong University Shanghai China) K Kai Jiang (Department of Pharmacy, The First Affiliated Hospital of the University of Science and Technology of China, and State Key Laboratory of Precision and Intelligent Chemistry) L Lechen Chen (School of Integrated Circuit (School of Information Science and Electronic Engineering) Shanghai Jiao Tong University Shanghai China) Y Yanting Li C Chenhui Jiang (State Key Laboratory of Metal Matrix Composites School of Materials Science and Engineering Shanghai Jiao Tong University Shanghai China) Z Zhi Yang F Fuzhen Xuan (School of Mechanical and Power Engineering East China University of Science and Technology–Utrecht University Joint Research Center for Sustainable and Circular Chemistry and Chemical Engineering East China University of Science and Technology Shanghai 200237 China) Y Yiping Guo

Abstract

ABSTRACT Multimodal strain sensors integrating diverse transduction mechanisms expand sensing dimensionality. However, most multimodal devices rely on complex integrated architectures to suppress crosstalk and lack intrinsic sensing pathways for capturing strain dynamics. Here, we present a highly simplified multimodal sensor based on a single sandwich‐type piezoelectric architecture, where a microcrack‐based piezoresistive layer simultaneously serves as the piezoelectric electrode, enabling intrinsically decoupled sensing within a shared electrical channel via impedance‐domain separation. Notably, the piezoelectric output directly reflects strain rate, complementing the piezoresistive readout of strain magnitude to achieve integrated dynamic–static strain sensing. Scalable and low‐cost ultrasonic spray coating is further developed to fabricate large‐area arrays (>10 cm × 10 cm) with uniform morphology and reliable performance. Owing to PVP‐regulated ink composition, the piezoresistive layer exhibits an ultrawide linear strain range of 0.001%–45% and a dynamic response up to 700 Hz. Integrated with multichannel acquisition electronics, the platform enables spatiotemporal mapping of micron‐scale deformations and strain trajectories, facilitating more reliable identification of failure sites under vibrational excitations and establishing a robust framework for comprehensive, high‐fidelity structural health assessment.

Article Details

Volume / Issue Vol. 38, Issue 37
Published July 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (10)

H

Hao Yin

T

Tao Wang

W

Wangze Ni

School of Integrated Circuit (School of Information Science and Electronic Engineering) Shanghai Jiao Tong University Shanghai China

K

Kai Jiang

Department of Pharmacy, The First Affiliated Hospital of the University of Science and Technology of China, and State Key Laboratory of Precision and Intelligent Chemistry

L

Lechen Chen

School of Integrated Circuit (School of Information Science and Electronic Engineering) Shanghai Jiao Tong University Shanghai China

Y

Yanting Li

C

Chenhui Jiang

State Key Laboratory of Metal Matrix Composites School of Materials Science and Engineering Shanghai Jiao Tong University Shanghai China

Z

Zhi Yang

F

Fuzhen Xuan

School of Mechanical and Power Engineering East China University of Science and Technology–Utrecht University Joint Research Center for Sustainable and Circular Chemistry and Chemical Engineering East China University of Science and Technology Shanghai 200237 China

Y

Yiping Guo