Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu

Y Yun-Fong Lee C Chih-Wen Chiu C Chin-Yen Chiu Y Yu-Chen Huang M Mei-Hsin Lo L Liu-Hsin-Chen Yang T Ting-Yi Cheng Z Zhong-Yen Yu C Chih-En Hsu (Mork Family Department of Chemical Engineering and Materials Science, University of Southern California) K Kai-Chi Lin P Po-Yu Chen W Wei-Cheih Huang J Jui-Sheng Chang S Shao-An Pan Y Yi-Cheng Su C Chin-Li Lin H Hang-Chen Hsieh C Chia-Hua Lin C Cheng-Yi Liu

Article Details

Volume / Issue Vol. 15, Issue 1
Published August 22, 2025
ISSN 2045-2322
Publisher Nature Portfolio

Journal Info

Scientific Reports

Nature Portfolio

ISSN: 2045-2322 Open Access Life Sciences

Authors (19)

Y

Yun-Fong Lee

C

Chih-Wen Chiu

C

Chin-Yen Chiu

Y

Yu-Chen Huang

M

Mei-Hsin Lo

L

Liu-Hsin-Chen Yang

T

Ting-Yi Cheng

Z

Zhong-Yen Yu

C

Chih-En Hsu

Mork Family Department of Chemical Engineering and Materials Science, University of Southern California

K

Kai-Chi Lin

P

Po-Yu Chen

W

Wei-Cheih Huang

J

Jui-Sheng Chang

S

Shao-An Pan

Y

Yi-Cheng Su

C

Chin-Li Lin

H

Hang-Chen Hsieh

C

Chia-Hua Lin

C

Cheng-Yi Liu