Generation and characterization of extended-length dislocations in BiSb alloys

S S. Frisone (Materials Science and Engineering, University of Michigan 1 , Ann Arbor, Michigan 48109,) M M. Choi J J. Essman (Applied Physics, University of Michigan 3 , Ann Arbor, Michigan 48109,) A A. Liu (Condensed Matter Physics and Materials Science Division, Brookhaven National Laboratory , Upton, New York 11973,) J J. Hung (Electrical Engineering and Computer Science, University of Michigan 4 , Ann Arbor, Michigan 48109,) Z Z. You S S. Sinha A A. Birge (Electrical and Computer Engineering, University of Illinois, Urbana-Champaign 6 , Illinois 61801,) H H. T. Johnson (Mechanical Science and Engineering, University of Illinois, Urbana-Champaign 2 , Illinois 61801,) M M. L. Lee (Electrical and Computer Engineering, University of Illinois, Urbana-Champaign 6 , Illinois 61801,) C C. Uher (Physics, University of Michigan 5 , Ann Arbor, Michigan 48109,) C C. Kurdak (Applied Physics, University of Michigan 3 , Ann Arbor, Michigan 48109,) R R. S. Goldman

Abstract

Narrow bandgap semiconducting Bi–Sb alloys with ∼10 at. % Sb were recently identified as strong topological insulators with non-trivial weak indices. Consequently, topologically-protected conduction is predicted to occur along certain dislocations. Recently, uniaxial compression of Bi0.87Sb0.13 was reported to lead to a conductivity enhancement presumed to be associated with dislocations. However, with dislocation lengths limited to 1–2 μm, the nature of the dislocations and their role in enhanced conduction in deformed BiSb remains unknown. Here, we generate multiple-micrometer-length {011}⟨100⟩ type dislocations in [111]-oriented Bi0.89Sb0.11 single crystals using cyclic uniaxial compression along [2¯11] and instrumented nanoindentation with a wedge-shaped tip. We consider the contributions to plastic deformation via secondary slip, including dislocation pile-ups, cross-slip, and twinning. Finally, we describe a framework for probing the topological states associated with dislocations using high magnetic fields to suppress bulk conduction and a Corbino contact geometry to eliminate side-surface conduction.

Article Details

Volume / Issue Vol. 140, Issue 2
Published July 14, 2026
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (13)

S

S. Frisone

Materials Science and Engineering, University of Michigan 1 , Ann Arbor, Michigan 48109,

M

M. Choi

J

J. Essman

Applied Physics, University of Michigan 3 , Ann Arbor, Michigan 48109,

A

A. Liu

Condensed Matter Physics and Materials Science Division, Brookhaven National Laboratory , Upton, New York 11973,

J

J. Hung

Electrical Engineering and Computer Science, University of Michigan 4 , Ann Arbor, Michigan 48109,

Z

Z. You

S

S. Sinha

A

A. Birge

Electrical and Computer Engineering, University of Illinois, Urbana-Champaign 6 , Illinois 61801,

H

H. T. Johnson

Mechanical Science and Engineering, University of Illinois, Urbana-Champaign 2 , Illinois 61801,

M

M. L. Lee

Electrical and Computer Engineering, University of Illinois, Urbana-Champaign 6 , Illinois 61801,

C

C. Uher

Physics, University of Michigan 5 , Ann Arbor, Michigan 48109,

C

C. Kurdak

Applied Physics, University of Michigan 3 , Ann Arbor, Michigan 48109,

R

R. S. Goldman