Fungal Als proteins hijack host death effector domains to promote inflammasome signaling

T Tingting Zhou N Norma V. Solis M Michaela Marshall Q Qing Yao (State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering) E Eric Pearlman S Scott G. Filler H Haoping Liu

Abstract

Abstract High-damaging Candida albicans strains tend to form hyphae and exacerbate intestinal inflammation in ulcerative colitis patients through IL-1β-dependent mechanisms. Fungal agglutinin-like sequence (Als) proteins worsen DSS-induced colitis in mouse models. FADD and caspase-8 are important regulators of gut homeostasis and inflammation. However, whether they link directly to fungal proteins is not fully understood. Here, we report that Als proteins induce IL-1β release in immune cells. We show that hyphal Als3 is internalized in macrophages and interacts with caspase-8 and the inflammasome adaptor apoptosis-associated speck-like protein containing a CARD (ASC). Caspase-8 is essential for Als3-mediated ASC oligomerization and IL-1β processing. In non-immune cells, Als3 is associated with cell death core components FADD and caspase-8. N-terminal Als3 (N-Als3) expressed in Jurkat cells partially inhibits apoptosis. Mechanistically, N-Als3 promotes oligomerization of FADD and caspase-8 through their death effector domains (DEDs). N-Als3 variants with a mutation in the peptide-binding cavity or amyloid-forming region are impaired in DED oligomerization. Together, these results demonstrate that DEDs are intracellular sensors of Als3. This study identifies additional potential targets to control hypha-induced inflammation.

Article Details

Volume / Issue Vol. 16, Issue 1
Published February 12, 2025
ISSN 2041-1723
Publisher Nature Portfolio

Journal Info

Nature Communications

Nature Portfolio

ISSN: 2041-1723 Open Access Life Sciences

Authors (7)

T

Tingting Zhou

N

Norma V. Solis

M

Michaela Marshall

Q

Qing Yao

State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering

E

Eric Pearlman

S

Scott G. Filler

H

Haoping Liu