Fabrication of high-quality large-scale ultrathin and narrow YBa2Cu3O7−δ superconducting meander wire array

J Jinlong Han Z Zongpei Li (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China 2 , Chengdu,) H Hanbin Wang H Huiqin Ma Z Zhengyang Luo (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China 2 , Chengdu,) H Hongwei Xu Y Yong Wang N Nannan Li C Chaoyi Yan J Jianwen Huang (State Key Laboratory of Electronic Thin Films and Integrated Devices) X Xiaoting Li Y Yuqing Liu (State Key Laboratory of Electronic Thin Films and Integrated Devices) M Mingjing Chen Y Yang Wang C Chao Yang P Peng Li Y Yi Luo (State Key Laboratory of Green Chemical Engineering and Industrial Catalysis)

Abstract

Large-scale quantum devices based on high-temperature superconductors and other sensitive materials are promising for next-generation quantum sensing and imaging, yet their practical realization is hindered by device non-uniformity, scalability, and degradation of materials properties during fabrication. Here we present a universal strategy for large-area high-temperature superconducting array with excellent uniformly. Using ultrathin YBa2Cu3O7−δ (YBCO) films and a high-precision SiNx stencil mask for fine electrodes definition, we preserve the intrinsic performance and large-area uniformity of YBCO prior to microwire patterning. Together with the low-damage film patterning process, we fabricate a 64 × 64 meandered wire array with a linewidth of 1 μm, edge roughness below 16 nm, and an effective sidewall-damage width of ∼50 nm. Comprehensive characterization of 121 devices reveals high uniformity, with a critical temperature of 75 K and 86.8% of units exhibiting a critical current within a narrow 2 ± 0.1 mA range. This scalable, low-damage approach not only overcomes the processing bottlenecks of YBCO but also provides a versatile platform applicable to a broad spectrum of fragile quantum materials, paving the way for next-generation superconducting electronics and imaging systems.

Article Details

Volume / Issue Vol. 139, Issue 13
Published April 07, 2026
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (17)

J

Jinlong Han

Z

Zongpei Li

State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China 2 , Chengdu,

H

Hanbin Wang

H

Huiqin Ma

Z

Zhengyang Luo

State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China 2 , Chengdu,

H

Hongwei Xu

Y

Yong Wang

N

Nannan Li

C

Chaoyi Yan

J

Jianwen Huang

State Key Laboratory of Electronic Thin Films and Integrated Devices

X

Xiaoting Li

Y

Yuqing Liu

State Key Laboratory of Electronic Thin Films and Integrated Devices

M

Mingjing Chen

Y

Yang Wang

C

Chao Yang

P

Peng Li

Y

Yi Luo

State Key Laboratory of Green Chemical Engineering and Industrial Catalysis