Enhancing the structure and piezoelectric properties of AlN/Mo multilayers via insertion of an AlN seed layer

H Hengyi Yin (Songshan Lake Materials Laboratory 1 , Dongguan 523808,) X Xuecui Zou (School of Integrated Circuits, Guangdong University of Technology 3 , Guangzhou, 51006,) Y Yihui Wu T Tongxin Lu (Songshan Lake Materials Laboratory 1 , Dongguan 523808,) Z Zilong Xing (Songshan Lake Materials Laboratory 1 , Dongguan 523808,) S Shangfeng Liu (School of Physics, Great Bay University 4 , Dongguan,) M Mao Ye L Lang Chen (Collaborative Innovation Center for Statistical Data Engineering, Technology and Application School of Statistics and Mathematics, Zhejiang Gongshang University) Y Ye Yuan

Abstract

In this work, systematic investigations were conducted to explore the effects and mechanisms of sputtering conditions on the structure and piezoelectric properties of aluminum nitride (AlN) films. Specifically, the contribution of a high-temperature-grown AlN seed layer to the performance of piezoelectric AlN films with molybdenum (Mo) electrodes was demonstrated. Compared with the unseeded AlN/Mo structure, the seeded system exhibited superior crystallization quality, reduced internal stress, and well-maintained surface morphology. Piezoresponse force microscopy measurements revealed a significant enhancement in the piezoelectric coefficient (d33) from 0.7 to 6.2 pm/V after incorporating the AlN seed layer. These results indicate that the high-temperature-grown AlN seed layer simultaneously improves both the structural integrity and piezoelectric performance of AlN films on Mo electrodes, providing a novel strategy for the development of high-performance AlN-based microelectromechanical system devices.

Article Details

Volume / Issue Vol. 139, Issue 11
Published March 21, 2026
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (9)

H

Hengyi Yin

Songshan Lake Materials Laboratory 1 , Dongguan 523808,

X

Xuecui Zou

School of Integrated Circuits, Guangdong University of Technology 3 , Guangzhou, 51006,

Y

Yihui Wu

T

Tongxin Lu

Songshan Lake Materials Laboratory 1 , Dongguan 523808,

Z

Zilong Xing

Songshan Lake Materials Laboratory 1 , Dongguan 523808,

S

Shangfeng Liu

School of Physics, Great Bay University 4 , Dongguan,

M

Mao Ye

L

Lang Chen

Collaborative Innovation Center for Statistical Data Engineering, Technology and Application School of Statistics and Mathematics, Zhejiang Gongshang University

Y

Ye Yuan