Enhancing bonding strength of the electroplated Cu pillars for semiconductor package by controlling grain orientation
J
JaeJun Yoon
T
TaekSoo Shin
D
DongJin Kim
K
KunSang Park
D
DongKeun Na
Y
Yeonju Go
S
SeungBoo Jung
Article Details
Journal
Scientific Reports
Volume / Issue
Vol. 16, Issue 1
Published
February 19, 2026
ISSN
2045-2322
Publisher
Nature Portfolio
Authors (7)
J
JaeJun Yoon
T
TaekSoo Shin
D
DongJin Kim
K
KunSang Park
D
DongKeun Na
Y
Yeonju Go
S
SeungBoo Jung
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