Enhanced spin–orbit torque efficiency via interface engineering in BiSb/X/CoFeB (X = Ge, NiAl, NiFeGe) topological heterostructures

R Rohiteswar Mondal (National Institute for Materials Science (NIMS) 1 , Tsukuba 305-0047,) Z Zhenchao Wen C Chandrasekhar Murapaka (Department of Material Science and Metallurgical Engineering (MSME), Indian Institute of Technology Hyderabad 5 , Kandi, Sangareddy, Telangana 502284,) S Seiji Mitani H Hiroaki Sukegawa Q Quang Le (Western Digital Inc. 2 , Great Oaks site, San Jose, California 95119,) X Xiaoyong Liu B Brian York (Western Digital Inc. 2 , Great Oaks site, San Jose, California 95119,) M Maki Maeda (Western Digital Inc. 3 , Fujisawa site, Kanagawa 252-0811,)

Abstract

Interlayer engineering is crucial for achieving efficient spin–orbit torque (SOT) generation in topological insulator (TI)/ferromagnet-based heterostructures. In this work, we investigated the impact of semiconducting and intermetallic interlayers, i.e., Ge, NiAl, and NiFeGe on SOT efficiency in topological BiSb/CoFeB heterostructures. Through comprehensive structural and transport analyses, we demonstrate that the Ge interlayer significantly enhances the performance. The insertion of a 1 nm-thick Ge layer significantly improves the crystallinity and orientation of BiSb, suppresses interfacial interdiffusion, and achieves a very low magnetic damping constant (αeff ∼ 0.006). The optimized BiSb/Ge/CoFeB structure exhibits an enhanced SOT efficiency of ∼50%, surpassing the performance of heterostructures without an interlayer, as well as those with NiAl or NiFeGe interlayers, which suffer from higher damping or reduced efficiency. Furthermore, we revealed that Ge thickness critically influences interfacial transparency, with excessive thickness degrading SOT efficiency. These findings establish Ge as an optimum interlayer material and indicate the importance of precise interface engineering to maximize charge-spin conversion in TI-based spintronic devices, paving the way for next-generation energy-efficient technologies.

Article Details

Volume / Issue Vol. 139, Issue 18
Published May 14, 2026
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (9)

R

Rohiteswar Mondal

National Institute for Materials Science (NIMS) 1 , Tsukuba 305-0047,

Z

Zhenchao Wen

C

Chandrasekhar Murapaka

Department of Material Science and Metallurgical Engineering (MSME), Indian Institute of Technology Hyderabad 5 , Kandi, Sangareddy, Telangana 502284,

S

Seiji Mitani

H

Hiroaki Sukegawa

Q

Quang Le

Western Digital Inc. 2 , Great Oaks site, San Jose, California 95119,

X

Xiaoyong Liu

B

Brian York

Western Digital Inc. 2 , Great Oaks site, San Jose, California 95119,

M

Maki Maeda

Western Digital Inc. 3 , Fujisawa site, Kanagawa 252-0811,