Electrical conductivity of multilayered Cu/Nb composites fabricated by accumulative roll bonding
Abstract
The electrical conductivity of nanolayered copper/niobium composites fabricated using accumulative roll bonding was investigated as a function of layer thickness. Cu/Nb was used as a model system to evaluate the processing-structure–property relationship stemming from the accumulative roll bonding process. The physical properties were compared against samples of individual average layer heights ranging from 193 to 25 nm. The electrical resistivity was measured over a temperature range of ∼3–300 K. Analysis on the role of interfaces on temperature dependence is conducted including the residual resistivity ratio and temperature coefficient of resistivity. It was found that electrical resistivity increases with decreasing layer height.
Article Details
Journal Info
Journal of Applied Physics
American Institute of Physics
Authors (9)
J. Justice
University of New Mexico 1 Department of Nuclear Engineering, , Albuquerque, New Mexico 87131,
A. Bauyrzhan
University of New Mexico 1 Department of Nuclear Engineering, , Albuquerque, New Mexico 87131,
Y. Wang
M. Khafizov
Department of Mechanical and Aerospace Engineering, The Ohio State University 2 , Columbus, Ohio 43210,
J. Y. Cheng
University of Minnesota 4 Department of Chemical Engineering and Materials Science, , Minneapolis, Minnesota 55455,
N. A. Mara
University of Minnesota 4 Department of Chemical Engineering and Materials Science, , Minneapolis, Minnesota 55455,
S. Mishra
F. Ronning
O. Anderoglu
University of New Mexico 1 Department of Nuclear Engineering, , Albuquerque, New Mexico 87131,