Dynamic Interface Engineering via Mechanistic Understanding of Copper Reconstruction in Electrochemical CO <sub>2</sub> Reduction Reaction

H Hanjoo Kim (Department of Chemical and Biomolecular Engineering) H Hongmin An (Department of Chemistry, Northwestern University, 2145 Sheridan Road, Evanston, Illinois 60208, United States) J Jinyeop Kim (Department of Chemical and Biomolecular Engineering) H Hyein Park (Department of Chemical and Biomolecular Engineering) C Chanwook Cha (Department of Chemical Engineering, School of Chemical Engineering and Applied Chemistry) R Robert Haaring (Department of Chemical and Biomolecular Engineering) H Hyunjoo Lee (Department of Chemical and Biomolecular Engineering) K Koohee Han (Department of Chemical Engineering, School of Chemical Engineering and Applied Chemistry) D Dong Young Chung (Department of Chemical and Biomolecular Engineering)

Article Details

Volume / Issue Vol. 148, Issue 6
Published February 18, 2026
Pages 6045-6056
ISSN 0002-7863
Publisher American Chemical Society

Journal Info

Journal of the American Chemical Society

American Chemical Society

ISSN: 0002-7863 Physical Sciences

Authors (9)

H

Hanjoo Kim

Department of Chemical and Biomolecular Engineering

H

Hongmin An

Department of Chemistry, Northwestern University, 2145 Sheridan Road, Evanston, Illinois 60208, United States

J

Jinyeop Kim

Department of Chemical and Biomolecular Engineering

H

Hyein Park

Department of Chemical and Biomolecular Engineering

C

Chanwook Cha

Department of Chemical Engineering, School of Chemical Engineering and Applied Chemistry

R

Robert Haaring

Department of Chemical and Biomolecular Engineering

H

Hyunjoo Lee

Department of Chemical and Biomolecular Engineering

K

Koohee Han

Department of Chemical Engineering, School of Chemical Engineering and Applied Chemistry

D

Dong Young Chung

Department of Chemical and Biomolecular Engineering