Dynamic Heterovalent Dual‐Cu Sites for O═O Cleavage in Electrocatalytic Oxygen Reduction Reaction
Abstract
ABSTRACT Activation and cleavage of the inert O═O bond represent a central challenge in energy electrochemistry. Here, the Cu dual‐atom catalyst (Cu‐DAC) is constructed via bottom‐up pre‐coordination assembly and post‐encapsulation pyrolysis. The resulting Cu‐DAC features a well‐defined Cu–Cu distance (∼3.31 Å) with switchable Cu 1+ /Cu 2+ states, enabling dynamic dual‐site coordination with O 2 . Cu‐DAC achieves 0.87 V RHE half‐wave potential for oxygen reduction reaction (ORR), a near‐unity 4e − selectivity, and outstanding stability. Multiple operando spectroscopic characterizations and ab initio dynamic simulations (AIMD) reveal that the dynamic heterovalent [Cu 1+─ O─O · − ─Cu 2+ ] unit elongates the O–O bond and promotes its cleavage via dual‐site confinement and electron donation. By specifically elucidating how these dual‐atom sites dynamically evolve to facilitate O─O bond cleavage, we provide vital atomic‐level principles for the rational design of dynamically active catalysts.
Article Details
Authors (11)
Ying Chen
Zhuoya Pei
Key Laboratory of Applied Surface and Colloid Chemistry Ministry of Education School of Chemistry and Chemical Engineering Shaanxi Normal University Xi'an China
Yao Dai
Shanghai Institute of Ceramics Chinese Academy of Sciences (SICCAS) Shanghai China
Shujiao Yang
Key Laboratory of Applied Surface and Colloid Chemistry Ministry of Education School of Chemistry and Chemical Engineering Shaanxi Normal University Xi'an China
Haitao Lei
Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education, School of Chemistry and Chemical Engineering
Ting Wang
Department of Radiation Oncology The Affiliated Cancer Hospital of Zhengzhou University and Henan Cancer Hospital Zhengzhou China
Jiwu Zhao
State Key Laboratory of Photocatalysis on Energy and Environment, College of Chemistry
Liang Huang
Research Center for Analytical Science, College of Chemistry
Rui Cao
Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education, School of Chemistry and Chemical Engineering
Ya Yan
Wei Zhang