Development of hypoeutectic SnBi alloy solder reinforced with WO3 nanoparticles for connecting Cu substrates via thermal bonding
N
Naglaa Fathy
K
Khalid M. Hafez
F
Fahad Abdulaziz
R
R. E. Abdelraouf
M
Mohamed Ramadan
Article Details
Journal
Scientific Reports
Volume / Issue
Vol. 15, Issue 1
Published
February 26, 2025
ISSN
2045-2322
Publisher
Nature Portfolio
Authors (5)
N
Naglaa Fathy
K
Khalid M. Hafez
F
Fahad Abdulaziz
R
R. E. Abdelraouf
M
Mohamed Ramadan
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