CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage
W
Winston Wong
S
S. T. Chiang
J
Jason C. S. Huang
X
X. D. Zhou
Article Details
Journal
Scientific Reports
Volume / Issue
Vol. 15, Issue 1
Published
November 21, 2025
ISSN
2045-2322
Publisher
Nature Portfolio
Authors (4)
W
Winston Wong
S
S. T. Chiang
J
Jason C. S. Huang
X
X. D. Zhou
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