Crack‐Free Transfer of Wafer‐Scale Freestanding Single‐Crystalline Nanomembranes Enabled by Elastically Graded Polymer
Abstract
Abstract Freestanding single‐crystalline nanomembranes have gained increasing attention as promising platforms for both fundamental research and advanced electronic applications. However, internal stress gradients arising from epitaxial strain within the oxide membranes often result in high crack density during fabrication, leading to unsatisfactory yield and limited reliability. Here, an elastically graded polymer (EGP) support that enables wafer‐scale crack‐free transfer of single‐crystalline oxide membranes are developed. The engineered elastic gradient within the EGP accommodates the internal strain of the oxide membrane, effectively minimizing crack formation during lift‐off. Notably, this ability to spatially control the interfacial stiffness between the polymer and the oxide film enables crack suppression under both tensile and compressive strain. This approach provides a robust and scalable route to producing high‐quality freestanding oxide membranes, paving the way not only for their integration into novel device architecture but also opening new avenues for scientific exploration of functional systems.
Article Details
Authors (23)
Ji‐Yun Moon
Department of Mechanical Engineering and Materials Science Washington University in St. Louis St. Louis Missouri 63130 USA
Sanggeun Bae
Department of Mechanical Engineering and Materials Science Washington University in St. Louis St. Louis Missouri 63130 USA
Jeehoon Ryu
School of Electrical and Electronic Engineering Yonsei University Seoul 03722 Republic of Korea
Seung‐Il Kim
Department of Mechanical Engineering and Materials Science Washington University in St. Louis St. Louis Missouri 63130 USA
Sangmoon Han
Department of Mechanical Engineering and Materials Science Washington University in St. Louis St. Louis Missouri 63130 USA
Justin S. Kim
Department of Mechanical Engineering and Materials Science Washington University in St. Louis St. Louis Missouri 63130 USA
Jonggyu Choi
School of Electrical and Electronic Engineering Yonsei University Seoul 03722 Republic of Korea
Seungsoo Kim
School of Electrical and Electronic Engineering Yonsei University Seoul 03722 Republic of Korea
Joo‐Hong Lee
Department of Integrated Display Engineering Yonsei University Seoul 03722 Republic of Korea
Seung‐Gu Choi
Department of Nanoengineering and Department of Nano Science and Technology, SKKU Advanced Institute of Nanotechnology (SAINT) Sungkyunkwan University Suwon 16419 Republic of Korea
Ting‐Ran Liu
Mork Family Department of Chemical Engineering & Materials Science University of Southern California Los Angeles CA 90089 USA
Soyeong Ahn
Advanced Process Development,Semiconductor R&D Center Samsung Electronics Hwaseong 18448 Republic of Korea
Jihyung Seo
Advanced Process Development,Semiconductor R&D Center Samsung Electronics Hwaseong 18448 Republic of Korea
Jun‐Hui Choi
Department of Electrical and Computer Engineering Sungkyunkwan University Suwon 16419 Republic of Korea
Hyung Jun Kwun
Department of Electrical and Computer Engineering Sungkyunkwan University Suwon 16419 Republic of Korea
Yu‐Tsun Shao
School of Applied and Engineering Physics Cornell University Ithaca New York USA
Hyeon‐Don Kim
Department of Nano‐mechanics, Nano‐Convergence Manufacturing Systems Research Division Korea Institute of Machinery and Materials (KIMM) Daejeon 34103 Republic of Korea
Jin‐Hong Park
Department of Electrical and Computer Engineering Sungkyunkwan University Suwon 16419 Republic of Korea
Jin‐Wook Lee
Department of Nanoengineering and Department of Nano Science and Technology, SKKU Advanced Institute of Nanotechnology (SAINT) Sungkyunkwan University Suwon 16419 Republic of Korea
Ji‐Won Park
R&D Center of JB Lab Corporation GwanakGu Seoul 08788 Republic of Korea
Jae‐Hyun Lee
Department of Electrical and Computer Engineering Sungkyunkwan University Suwon Republic of Korea
Jong‐Hyun Ahn
School of Electrical and Electronic Engineering Yonsei University Seoul 03722 Republic of Korea
Sang‐Hoon Bae
Department of Mechanical Engineering and Materials Science Washington University in St. Louis St. Louis Missouri 63130 USA