An IoT Based Semi-Automation Technology for E-Waste Segregation

Abstract

The rapid increase in electronic waste has created a need for simple and safe recovery methods for reusable components from discarded circuit boards. Manual removal of components from printed circuit boards (PCBs) involves direct exposure to heat, fumes and sharp edges, making it unsafe and slow. This paper presents a compact, semi-automated system that uses a two-axis robotic arm to depopulate components from mobile PCBs. The system is built on a150mm×150mm wooden platform and uses an X–Y motion mechanism mounted below the surface. Three stations a PCB loading area, a solder-melting pot, and a collection tray are arranged in series on the top of the platform. The robotic arm moves horizontally and forward backward to pick a PCB, dip it in a heated solder bath for a very short duration, and transfer the loosened components into a tray. The mechanism is driven by low-cost geared motors and controlled through an Arduino microcontroller. Experimental trials on PCBs show that the system can reliably detach small surface-mount components after a 2–3 second dip. The work demonstrates a practical and low-cost approach suitable for small-scale e-waste processing units.