A Printed Microscopic Universal Gradient Interface for Super Stretchable Strain‐Insensitive Bioelectronics
Abstract
AbstractStretchable electronics capable of conforming to nonplanar and dynamic human body surfaces are central for creating implantable and on‐skin devices for high‐fidelity monitoring of diverse physiological signals. While various strategies have been developed to produce stretchable devices, the signals collected from such devices are often highly sensitive to local strain, resulting in inevitable convolution with surface strain‐induced motion artifacts that are difficult to distinguish from intrinsic physiological signals. Here all‐printed super stretchable strain‐insensitive bioelectronics using a unique universal gradient interface (UGI) are reported to bridge the gap between soft biomaterials and stiff electronic materials. Leveraging a versatile aerosol‐based multi‐materials printing technique that allows precise spatial control over the local stiffnesses with submicron resolution, the UGI enables strain‐insensitive electronic devices with negligible resistivity changes under a 180% uniaxial stretch ratio. Various stretchable devices are directly printed on the UGI for on‐skin health monitoring with high signal quality and near‐perfect immunity to motion artifacts, including semiconductor‐based photodetectors for sensing blood oxygen saturation levels and metal‐based temperature sensors. The concept in this work will significantly simplify the fabrication and accelerate the development of a broad range of wearable and implantable bioelectronics for real‐time health monitoring and personalized therapeutics.
Article Details
Authors (17)
Kaidong Song
Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA
Jingyuan Zhou
Chen Wei
Department of Mechanical and Aerospace Engineering, University of California Los Angeles
Ashok Ponnuchamy
Md Omarsany Bappy
Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA
Yuxuan Liao
Qiang Jiang
Department of Animal Genetics, College of Animal Science and Technology, Nanjing Agricultural University
Yipu Du
Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA
Connor J. Evans
Brian C. Wyatt
Thomas O’ Sullivan
Department of Electrical Engineering University of Notre Dame Notre Dame IN 46556 USA
Ryan K. Roeder
Babak Anasori
Anthony J. Hoffman
Lihua Jin
Department of Mechanical and Aerospace Engineering, University of California Los Angeles
Xiangfeng Duan
Yanliang Zhang