3D printing of electrostatic actuation and adhesion devices: Future opportunities and challenges

J Jingcheng Xiao (School of Physical Science and Technology) K Kunlin Wu J Junwei Li (Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education and School of Chemistry and Chemical Engineering) Y Yifan Wang

Abstract

In recent years, electrostatic devices have attracted considerable attention due to their broad applications in actuators, sensors, and adhesion systems. Traditionally, these devices are fabricated through manual stacking methods, which are time-consuming, limit design flexibility, and hinder the development of complex electrostatic systems. Meanwhile, 3D printing has emerged as a powerful tool in various fields, enabling the rapid fabrication of intricate geometries with high resolution. This capacity makes additive manufacturing a promising approach for accelerating prototyping, enabling customization, and integrating functionalities in electrostatic devices’ fabrication. In this Perspective, we review representative types of electrostatic actuation and adhesion devices, highlighting their applications and conventional fabrication methods. We then examine the current state of 3D printing in electrostatic device manufacturing, analyzing both its potential benefits and the limitations that must be addressed for broader adoption. Finally, we outline future research directions to overcome these limitations, emphasizing the need for high-performance dielectric and conductive materials, as well as advanced multi-scale fabrication strategies. By addressing these challenges, the integration of 3D printing and electrostatic device fabrication has the potential to drive the development of next-generation actuators and adhesion systems.

Article Details

Volume / Issue Vol. 138, Issue 9
Published September 07, 2025
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (4)

J

Jingcheng Xiao

School of Physical Science and Technology

K

Kunlin Wu

J

Junwei Li

Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education and School of Chemistry and Chemical Engineering

Y

Yifan Wang