Sun, H., Ding, S., Zhang, J., Chen, Y., Wu, X., Zhang, Z., Zhou, T., Yan, Z., Zhang, K., Zhao, Q., Xie, W., Yang, K., Feng, G., Nakamura, E., Chen, J., Zhang, W. (2025). Zinc Plating on Copper Proceeds via Breakdown of a Capacitive Electric Double Layer. Journal of the American Chemical Society. https://doi.org/10.1021/jacs.5c17948