Xu Tian, Songjie Yang, Xiaoyu Liu, Yupu Tang, Shanshan Ju, Renbo Lei, Jinxiong Li, Yuancan Ding, Shengcheng Zhou, Juntong Kang, Yuyang Qiao, Yi Zhou, Runsheng Wang, Ming Li, Gaoda Chai, Xinwei Wang. "Turing-patterned Ta2S3 enables sub-2 nm diffusion barrier for advanced Cu interconnects." Nature Communications, 2026. doi:10.1038/s41467-026-71545-2