He, Y., Wan, S., Zhou, S., Huang, Z., Chang, Y., Yang, Y., Gao, X., Xu, Y., Yang, J., Gao, S., Ma, D., Zhou, Y., Sun, H. (2025). Thermal-mechanical perspectives on hydrophilic- and surface-activated-bonding Si/SiC interfaces for SOI's thermal management enhancement. Applied Physics Letters. https://doi.org/10.1063/5.0253834