Lee, G., Oh, Y., Hwang, J., Hong, S. W., Song, S., Shin, K. W., Lee, J., Yoon, S., Kim, D. K., Kim‐Lee, H., Kim, D., Kim, J., Shin, D., Yu, M., Lee, J., Park, J., Lee, H. M., Kim, S. W., Na, B., Yun, S., Kim, Y., Jeong, J., Park, C., Hwang, K., Yoo, G. (2025). Scalable Van Der Waals Integration of III‐N Devices Over 2D Materials for CMOS‐Compatible Architectures. Advanced Materials. https://doi.org/10.1002/adma.202420060