Parsons, R., Jang, K., Wang, Y., Novick, A., Smith, A. M., Tison, C. C., Gebregiorgis, Y., Deenadayalan, V., Niekerk, M. V., Carpenter, L., Ngai, T., Leake, G., Coleman, D., Meng, X., Preble, S., Fanto, M. L., Bergman, K., Rizzo, A. (2025). Highly uniform thermally undercut silicon photonic devices in a 300 mm CMOS foundry process. Scientific Reports. https://doi.org/10.1038/s41598-025-14480-4