Narinderjit Singh Sawaran Singh, Waqed H. Hassan, Waleed Alaloosi, Watfaa Khayri Younis, Banaz Shahab Haji, Mahmut Taner, Soheil Salahshour, S. Mohammad Sajadi. "Effects of grinding penetration depth and abrasive grain spacing on atomic interactions and material removal mechanisms in silicon during ultrasonic vibration-assisted grinding: a molecular dynamics study." Scientific Reports (2026). https://doi.org/10.1038/s41598-026-61096-3