Chen, X., Wang, B., Duan, J., Yang, B., Wang, L., Li, S., Luo, Y., Luo, S., Sun, B., Wang, C., Tian, H., Li, X., Lv, J., Shao, J. (2025). Compression‐Durable Soft Electronic Circuits Enabled by Embedding Self‐Healing Biphasic Liquid‐Solid Metal Into Microstructured Elastomeric Channels (Adv. Mater. 21/2025). Advanced Materials. https://doi.org/10.1002/adma.202570151